IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
SIP1X17-001B

SIP1X17-001B

SIP1X17-001B-SIP SOCKET 17 CTS

Amphenol ICC (FCI)

4,995
RFQ
SIP1X17-001B

Datasheet

SIP1x Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X10-160B

SIP050-1X10-160B

1X10-160B-SIP SOCKET 10 CTS

Amphenol ICC (FCI)

2,215
RFQ
SIP050-1X10-160B

Datasheet

SIP050-1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X11-160B

SIP050-1X11-160B

1X11-160B-SIP SOCKET 11 CTS

Amphenol ICC (FCI)

2,063
RFQ
SIP050-1X11-160B

Datasheet

SIP050-1x Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X13-157B

SIP050-1X13-157B

1X13-157B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

4,179
RFQ
SIP050-1X13-157B

Datasheet

SIP050-1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP628-011B

DIP628-011B

DIP628-011B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

1,064
RFQ
DIP628-011B

Datasheet

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP624-001B

DIP624-001B

DIP624-001B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

2,438
RFQ
DIP624-001B

Datasheet

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X10-041B

SIP1X10-041B

SIP1X10-041B-SIP SOCKET 10 CTS

Amphenol ICC (FCI)

4,073
RFQ
SIP1X10-041B

Datasheet

SIP1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
DIP632-014B

DIP632-014B

DIP632-014B-DIP SOCKET 32 CTS

Amphenol ICC (FCI)

4,308
RFQ
DIP632-014B

Datasheet

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X14-157B

SIP050-1X14-157B

1X14-157B-SIP SOCKET 14 CTS

Amphenol ICC (FCI)

1,967
RFQ
SIP050-1X14-157B

Datasheet

SIP050-1x Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X12-160B

SIP050-1X12-160B

1X12-160B-SIP SOCKET 12 CTS

Amphenol ICC (FCI)

2,560
RFQ
SIP050-1X12-160B

Datasheet

SIP050-1x Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
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