IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
DIP632-011B

DIP632-011B

DIP632-011B-DIP SOCKET 32 CTS

Amphenol ICC (FCI)

2,882
RFQ
DIP632-011B

Datasheet

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X20-001B

SIP1X20-001B

SIP1X20-001B-SIP SOCKET 20 CTS

Amphenol ICC (FCI)

2,375
RFQ
SIP1X20-001B

Datasheet

SIP1x Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X15-157B

SIP050-1X15-157B

1X15-157B-SIP SOCKET 15 CTS

Amphenol ICC (FCI)

1,351
RFQ
SIP050-1X15-157B

Datasheet

SIP050-1x Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X13-160B

SIP050-1X13-160B

1X13-160B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

3,161
RFQ
SIP050-1X13-160B

Datasheet

SIP050-1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP628-001B

DIP628-001B

DIP628-001B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

4,255
RFQ
DIP628-001B

Datasheet

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X16-157B

SIP050-1X16-157B

1X16-157B-SIP SOCKET 16 CTS

Amphenol ICC (FCI)

4,283
RFQ
SIP050-1X16-157B

Datasheet

SIP050-1x Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X27-014B

SIP1X27-014B

SIP1X27-014B-SIP SOCKET 27 CTS

Amphenol ICC (FCI)

3,673
RFQ
SIP1X27-014B

Datasheet

SIP1x Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X14-160B

SIP050-1X14-160B

1X14-160B-SIP SOCKET 14 CTS

Amphenol ICC (FCI)

3,156
RFQ
SIP050-1X14-160B

Datasheet

SIP050-1x Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP640-014B

DIP640-014B

DIP640-014B-DIP SOCKET 40 CTS

Amphenol ICC (FCI)

3,641
RFQ
DIP640-014B

Datasheet

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X32-014B

SIP1X32-014B

SIP1X32-014B-SIP SOCKET 32 CTS

Amphenol ICC (FCI)

1,570
RFQ
SIP1X32-014B

Datasheet

SIP1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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