IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
SIP050-1X19-157B

SIP050-1X19-157B

1X19-157B-SIP SOCKET 19 CTS

Amphenol ICC (FCI)

4,934
RFQ
SIP050-1X19-157B

Datasheet

SIP050-1x Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP648-014B

DIP648-014B

DIP648-014B-DIP SOCKET 48 CTS

Amphenol ICC (FCI)

3,654
RFQ
DIP648-014B

Datasheet

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X17-160B

SIP050-1X17-160B

1X17-160B-SIP SOCKET 17 CTS

Amphenol ICC (FCI)

2,339
RFQ
SIP050-1X17-160B

Datasheet

SIP050-1x Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X21-157B

SIP050-1X21-157B

1X21-157B-SIP SOCKET 21 CTS

Amphenol ICC (FCI)

1,405
RFQ
SIP050-1X21-157B

Datasheet

SIP050-1x Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X27-001B

SIP1X27-001B

SIP1X27-001B-SIP SOCKET 27 CTS

Amphenol ICC (FCI)

2,091
RFQ
SIP1X27-001B

Datasheet

SIP1x Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X18-160B

SIP050-1X18-160B

1X18-160B-SIP SOCKET 18 CTS

Amphenol ICC (FCI)

4,147
RFQ
SIP050-1X18-160B

Datasheet

SIP050-1x Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X32-001B

SIP1X32-001B

SIP1X32-001B-SIP SOCKET 32 POS

Amphenol ICC (FCI)

4,303
RFQ
SIP1X32-001B

Datasheet

SIP1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X22-157B

SIP050-1X22-157B

1X22-157B-SIP SOCKET 22 CTS

Amphenol ICC (FCI)

3,266
RFQ
SIP050-1X22-157B

Datasheet

SIP050-1x Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP640-001B

DIP640-001B

DIP640-001B-DIP SOCKET 40 CTS

Amphenol ICC (FCI)

4,349
RFQ
DIP640-001B

Datasheet

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X19-160B

SIP050-1X19-160B

1X19-160B-SIP SOCKET 19 CTS

Amphenol ICC (FCI)

1,064
RFQ
SIP050-1X19-160B

Datasheet

SIP050-1x Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
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