IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
SIP050-1X10-157B

SIP050-1X10-157B

1X10-157B-SIP SOCKET 10 CTS

Amphenol ICC (FCI)

2,652
RFQ
SIP050-1X10-157B

Datasheet

SIP050-1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DILB42P-223TLF

DILB42P-223TLF

CONN IC DIP SOCKET 42POS TINLEAD

Amphenol ICC (FCI)

2,817
RFQ
DILB42P-223TLF

Datasheet

DILB Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
SIP1X20-011B

SIP1X20-011B

SIP1X20-011B-SIP SOCKET 20 CTS

Amphenol ICC (FCI)

3,458
RFQ
SIP1X20-011B

Datasheet

SIP1x Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
DIP328-011B

DIP328-011B

DIP328-011B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

4,671
RFQ
DIP328-011B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X16-011B

SIP1X16-011B

SIP1X16-011B-SIP SOCKET 16 CTS

Amphenol ICC (FCI)

3,502
RFQ
SIP1X16-011B

Datasheet

SIP1x Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X09-160B

SIP050-1X09-160B

1X09-160B-SIP SOCKET 9 CTS

Amphenol ICC (FCI)

1,253
RFQ
SIP050-1X09-160B

Datasheet

SIP050-1x Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X11-157B

SIP050-1X11-157B

1X11-157B-SIP SOCKET 11 CTS

Amphenol ICC (FCI)

1,521
RFQ
SIP050-1X11-157B

Datasheet

SIP050-1x Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X21-011B

SIP1X21-011B

SIP1X21-011B-SIP SOCKET 21 CTS

Amphenol ICC (FCI)

3,770
RFQ
SIP1X21-011B

Datasheet

SIP1x Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
DIP324-001B

DIP324-001B

DIP324-001B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

1,240
RFQ
DIP324-001B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X12-157B

SIP050-1X12-157B

1X12-157B-SIP SOCKET 12 CTS

Amphenol ICC (FCI)

1,753
RFQ
SIP050-1X12-157B

Datasheet

SIP050-1x Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
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