IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
DIP324-014B

DIP324-014B

DIP324-014B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

2,935
RFQ
DIP324-014B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X15-011B

SIP1X15-011B

SIP1X15-011B-SIP SOCKET 15 CTS

Amphenol ICC (FCI)

3,151
RFQ
SIP1X15-011B

Datasheet

SIP1x Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X13-001B

SIP1X13-001B

SIP1X13-001B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

1,132
RFQ
SIP1X13-001B

Datasheet

SIP1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
DIP324-011B

DIP324-011B

DIP324-011B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

2,493
RFQ
DIP324-011B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP318-001B

DIP318-001B

DIP318-001B-DIP SOCKET 18 CTS

Amphenol ICC (FCI)

2,933
RFQ
DIP318-001B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X09-157B

SIP050-1X09-157B

1X09-157B-SIP SOCKET 9 CTS

Amphenol ICC (FCI)

2,015
RFQ
SIP050-1X09-157B

Datasheet

SIP050-1x Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP320-001B

DIP320-001B

DIP320-001B-DIP SOCKET 20 CTS

Amphenol ICC (FCI)

4,471
RFQ
DIP320-001B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X08-160B

SIP050-1X08-160B

1X08-160B-SIP SOCKET 8 CTS

Amphenol ICC (FCI)

4,283
RFQ
SIP050-1X08-160B

Datasheet

SIP050-1x Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP624-011B

DIP624-011B

DIP624-011B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

3,213
RFQ
DIP624-011B

Datasheet

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP328-014B

DIP328-014B

DIP328-014B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

1,833
RFQ
DIP328-014B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
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