IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
DIP314-001BLF

DIP314-001BLF

CONN IC DIP SOCKET 14POS GOLD

Amphenol ICC (FCI)

3,497
RFQ
DIP314-001BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP324-001BLF

DIP324-001BLF

CONN IC DIP SOCKET 24POS GOLD

Amphenol ICC (FCI)

3,294
RFQ
DIP324-001BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP316-001BLF

DIP316-001BLF

CONN IC DIP SOCKET 16POS GOLD

Amphenol ICC (FCI)

4,980
RFQ
DIP316-001BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP316-014BLF

DIP316-014BLF

CONN IC DIP SOCKET 16POS TIN

Amphenol ICC (FCI)

2,017
RFQ
DIP316-014BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X04-157BLF

SIP050-1X04-157BLF

CONN SOCKET SIP 4POS TIN

Amphenol ICC (FCI)

2,144
RFQ
SIP050-1X04-157BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X27-157BLF

SIP050-1X27-157BLF

CONN SOCKET SIP 27POS TIN

Amphenol ICC (FCI)

3,672
RFQ
SIP050-1X27-157BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X20-041BLF

SIP1X20-041BLF

CONN SOCKET SIP 20POS GOLD

Amphenol ICC (FCI)

2,930
RFQ
SIP1X20-041BLF

Datasheet

SIP1x Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
DIP628-014BLF

DIP628-014BLF

CONN IC DIP SOCKET 28POS TIN

Amphenol ICC (FCI)

2,631
RFQ
DIP628-014BLF

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X18-157BLF

SIP050-1X18-157BLF

CONN SOCKET SIP 18POS TIN

Amphenol ICC (FCI)

3,369
RFQ
SIP050-1X18-157BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP306-001BLF

DIP306-001BLF

CONN IC DIP SOCKET 6POS GOLD

Amphenol ICC (FCI)

3,949
RFQ
DIP306-001BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
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