IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
SIP1X12-011BLF

SIP1X12-011BLF

CONN SOCKET SIP 12POS GOLD

Amphenol ICC (FCI)

1,695
RFQ
SIP1X12-011BLF

Datasheet

SIP1x Bulk Obsolete SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X32-001BLF

SIP1X32-001BLF

CONN SOCKET SIP 32POS GOLD

Amphenol ICC (FCI)

1,885
RFQ
SIP1X32-001BLF

Datasheet

SIP1x Bulk Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X02-011BLF

SIP1X02-011BLF

CONN SOCKET SIP 2POS GOLD

Amphenol ICC (FCI)

3,340
RFQ
SIP1X02-011BLF

Datasheet

SIP1x Bulk Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X11-011BLF

SIP1X11-011BLF

CONN SOCKET SIP 11POS GOLD

Amphenol ICC (FCI)

2,048
RFQ
SIP1X11-011BLF

Datasheet

SIP1x Bulk Obsolete SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
DIP632-001BLF

DIP632-001BLF

CONN IC DIP SOCKET 32POS GOLD

Amphenol ICC (FCI)

3,219
RFQ
DIP632-001BLF

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP628-001BLF

DIP628-001BLF

CONN IC DIP SOCKET 28POS GOLD

Amphenol ICC (FCI)

4,951
RFQ
DIP628-001BLF

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X20-011BLF

SIP1X20-011BLF

CONN SOCKET SIP 20POS GOLD

Amphenol ICC (FCI)

2,099
RFQ
SIP1X20-011BLF

Datasheet

SIP1x Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
DIP640-001BLF

DIP640-001BLF

CONN IC DIP SOCKET 40POS GOLD

Amphenol ICC (FCI)

2,642
RFQ
DIP640-001BLF

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X16-011BLF

SIP1X16-011BLF

CONN SOCKET SIP 16POS GOLD

Amphenol ICC (FCI)

1,912
RFQ
SIP1X16-011BLF

Datasheet

SIP1x Bulk Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X10-001BLF

SIP1X10-001BLF

CONN SOCKET SIP 10POS GOLD

Amphenol ICC (FCI)

4,637
RFQ
SIP1X10-001BLF

Datasheet

SIP1x Bulk Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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