IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
SIP1X13-001BLF

SIP1X13-001BLF

SIP1X13-001BLF SIP SOCKET 13 CTS

Amphenol ICC (FCI)

4,450
RFQ
SIP1X13-001BLF

Datasheet

SIP1x Bulk Obsolete SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X02-001BLF

SIP1X02-001BLF

CONN SOCKET SIP 2POS GOLD

Amphenol ICC (FCI)

3,337
RFQ
SIP1X02-001BLF

Datasheet

SIP1x Bulk Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X17-001BLF

SIP1X17-001BLF

CONN SOCKET SIP 17POS GOLD

Amphenol ICC (FCI)

2,337
RFQ
SIP1X17-001BLF

Datasheet

SIP1x Bulk Obsolete SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
DIP328-014BLF

DIP328-014BLF

CONN IC DIP SOCKET 28POS TIN

Amphenol ICC (FCI)

4,675
RFQ
DIP328-014BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP324-014BLF

DIP324-014BLF

CONN IC DIP SOCKET 24POS TIN

Amphenol ICC (FCI)

3,364
RFQ
DIP324-014BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP328-011BLF

DIP328-011BLF

CONN IC DIP SOCKET 28POS GOLD

Amphenol ICC (FCI)

1,795
RFQ
DIP328-011BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP318-011BLF

DIP318-011BLF

CONN IC DIP SOCKET 18POS GOLD

Amphenol ICC (FCI)

1,882
RFQ
DIP318-011BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP316-011BLF

DIP316-011BLF

CONN IC DIP SOCKET 16POS GOLD

Amphenol ICC (FCI)

3,029
RFQ
DIP316-011BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP324-011BLF

DIP324-011BLF

CONN IC DIP SOCKET 24POS GOLD

Amphenol ICC (FCI)

4,497
RFQ
DIP324-011BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X20-001BLF

SIP1X20-001BLF

CONN SOCKET SIP 20POS GOLD

Amphenol ICC (FCI)

4,397
RFQ
SIP1X20-001BLF

Datasheet

SIP1x Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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