IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
DIP640-011BLF

DIP640-011BLF

CONN IC DIP SOCKET 40POS GOLD

Amphenol ICC (FCI)

3,056
RFQ
DIP640-011BLF

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP624-011BLF

DIP624-011BLF

CONN IC DIP SOCKET 24POS GOLD

Amphenol ICC (FCI)

1,893
RFQ
DIP624-011BLF

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X10-011BLF

SIP1X10-011BLF

CONN SOCKET SIP 10POS GOLD

Amphenol ICC (FCI)

3,296
RFQ
SIP1X10-011BLF

Datasheet

SIP1x Bulk Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X15-014BLF

SIP1X15-014BLF

CONN SOCKET SIP 15POS TIN

Amphenol ICC (FCI)

1,800
RFQ
SIP1X15-014BLF

Datasheet

SIP1x Bulk Obsolete SIP 15 (1 x 15) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X12-014BLF

SIP1X12-014BLF

CONN SOCKET SIP 12POS TIN

Amphenol ICC (FCI)

2,113
RFQ
SIP1X12-014BLF

Datasheet

SIP1x Bulk Obsolete SIP 12 (1 x 12) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X21-011BLF

SIP1X21-011BLF

CONN SOCKET SIP 21POS GOLD

Amphenol ICC (FCI)

4,167
RFQ
SIP1X21-011BLF

Datasheet

SIP1x Bulk Obsolete SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X13-011BLF

SIP1X13-011BLF

CONN SOCKET SIP 13POS GOLD

Amphenol ICC (FCI)

1,497
RFQ
SIP1X13-011BLF

Datasheet

SIP1x Bulk Obsolete SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X15-011BLF

SIP1X15-011BLF

CONN SOCKET SIP 15POS GOLD

Amphenol ICC (FCI)

1,984
RFQ
SIP1X15-011BLF

Datasheet

SIP1x Bulk Obsolete SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X08-014BLF

SIP1X08-014BLF

CONN SOCKET SIP 8POS TIN

Amphenol ICC (FCI)

4,430
RFQ
SIP1X08-014BLF

Datasheet

SIP1x Bulk Obsolete SIP 8 (1 x 8) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X27-001BLF

SIP1X27-001BLF

CONN SOCKET SIP 27POS GOLD

Amphenol ICC (FCI)

3,197
RFQ
SIP1X27-001BLF

Datasheet

SIP1x Bulk Obsolete SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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