IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
DIP306-001B

DIP306-001B

SOCKET 6 CTS

Amphenol ICC (FCI)

4,271
RFQ
DIP306-001B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X03-157B

SIP050-1X03-157B

1X03-157B-SIP SOCKET 3 CTS

Amphenol ICC (FCI)

4,141
RFQ
SIP050-1X03-157B

Datasheet

SIP050-1x Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X06-011B

SIP1X06-011B

SIP1X06-011B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

1,630
RFQ
SIP1X06-011B

Datasheet

SIP1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
DIP308-001B

DIP308-001B

DIP SOCKET 8 CTS

Amphenol ICC (FCI)

4,198
RFQ
DIP308-001B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X03-160B

SIP050-1X03-160B

1X03-160B-SIP SOCKET 3 CTS

Amphenol ICC (FCI)

4,578
RFQ
SIP050-1X03-160B

Datasheet

SIP050-1x Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X07-014B

SIP1X07-014B

SIP1X07-014B-SIP SOCKET 7 CTS

Amphenol ICC (FCI)

4,813
RFQ
SIP1X07-014B

Datasheet

SIP1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X06-001B

SIP1X06-001B

SIP1X06-001B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

3,951
RFQ
SIP1X06-001B

Datasheet

SIP1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP41430-001LF

SIP41430-001LF

CONN SOCKET SIP 2POS TIN

Amphenol ICC (FCI)

1,139
RFQ
SIP41430-001LF

Datasheet

- Tape & Reel (TR) Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyamide (PA), Nylon -
SIP050-1X04-157B

SIP050-1X04-157B

1X04-157B-SIP SOCKET 4 CTS

Amphenol ICC (FCI)

1,653
RFQ
SIP050-1X04-157B

Datasheet

SIP050-1x Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X07-011B

SIP1X07-011B

SIP1X07-011B-SIP SOCKET 7 CTS

Amphenol ICC (FCI)

3,035
RFQ
SIP1X07-011B

Datasheet

SIP1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
Total 314 Record«Prev1234567...32Next»
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER