IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
SIP1X08-011B

SIP1X08-011B

SIP1X08-011B-SIP SOCKET 8 CTS

Amphenol ICC (FCI)

4,312
RFQ
SIP1X08-011B

Datasheet

SIP1x Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X04-160B

SIP050-1X04-160B

1X04-160B-SIP SOCKET 4 CTS

Amphenol ICC (FCI)

3,528
RFQ
SIP050-1X04-160B

Datasheet

SIP050-1x Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X05-157B

SIP050-1X05-157B

1X05-157B-SIP SOCKET 5 CTS

Amphenol ICC (FCI)

1,612
RFQ
SIP050-1X05-157B

Datasheet

SIP050-1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X10-011B

SIP1X10-011B

SIP1X10-011B-SIP SOCKET 10 CTS

Amphenol ICC (FCI)

3,736
RFQ
SIP1X10-011B

Datasheet

SIP1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X08-001B

SIP1X08-001B

SIP1X08-001B-SIP SOCKET 8 CTS

Amphenol ICC (FCI)

3,267
RFQ
SIP1X08-001B

Datasheet

SIP1x Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
DIP314-011B

DIP314-011B

DIP SOCKET 14 CTS

Amphenol ICC (FCI)

4,895
RFQ
DIP314-011B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X05-041B

SIP1X05-041B

SIP1X05-041B-SIP SOCKET 5 CTS

Amphenol ICC (FCI)

1,770
RFQ
SIP1X05-041B

Datasheet

SIP1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X06-157B

SIP050-1X06-157B

1X06-157B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

2,407
RFQ
SIP050-1X06-157B

Datasheet

SIP050-1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP050-1X05-160B

SIP050-1X05-160B

1X05-160B-SIP SOCKET 5 CTS

Amphenol ICC (FCI)

2,892
RFQ
SIP050-1X05-160B

Datasheet

SIP050-1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP316-011B

DIP316-011B

DIP SOCKET 16 CTS

Amphenol ICC (FCI)

3,072
RFQ
DIP316-011B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
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