IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
SIP1X03-011B

SIP1X03-011B

SIP1X03-011B-SIP SOCKET 3 CTS

Amphenol ICC (FCI)

3,535
RFQ
SIP1X03-011B

Datasheet

SIP1x Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X02-157B

SIP050-1X02-157B

1X02-157B-SIP SOCKET 2 CTS

Amphenol ICC (FCI)

3,803
RFQ
SIP050-1X02-157B

Datasheet

SIP050-1x Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X05-014B

SIP1X05-014B

SIP1X05-014B-SIP SOCKET 5 CTS

Amphenol ICC (FCI)

3,237
RFQ
SIP1X05-014B

Datasheet

SIP1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X04-014B

SIP1X04-014B

SIP1X04-014B-SIP SOCKET 4 CTS

Amphenol ICC (FCI)

3,820
RFQ
SIP1X04-014B

Datasheet

SIP1x Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X04-011B

SIP1X04-011B

SIP1X04-011B-SIP SOCKET 4 CTS

Amphenol ICC (FCI)

4,388
RFQ
SIP1X04-011B

Datasheet

SIP1x Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP050-1X02-160B

SIP050-1X02-160B

1X02-160B-SIP SOCKET 2 CTS

Amphenol ICC (FCI)

1,201
RFQ
SIP050-1X02-160B

Datasheet

SIP050-1x Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X05-011B

SIP1X05-011B

SIP1X05-011B-SIP SOCKET 5 CTS

Amphenol ICC (FCI)

4,211
RFQ
SIP1X05-011B

Datasheet

SIP1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
DIP308-014B

DIP308-014B

DIP SOCKET 8 CTS

Amphenol ICC (FCI)

1,593
RFQ
DIP308-014B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
DIP308-011B

DIP308-011B

DIP SOCKET 8 CTS

Amphenol ICC (FCI)

2,219
RFQ
DIP308-011B

Datasheet

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X06-014B

SIP1X06-014B

SIP1X06-014B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

1,798
RFQ
SIP1X06-014B

Datasheet

SIP1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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