IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-1724-T-H

APH-1724-T-H

APH-1724-T-H

Samtec Inc.

3,047
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0724-T-H

APH-0724-T-H

APH-0724-T-H

Samtec Inc.

1,397
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0824-T-H

APH-0824-T-H

APH-0824-T-H

Samtec Inc.

4,846
RFQ

-

* - Active - - - - - - - - - - - - - - -
714-93-120-41-001000

714-93-120-41-001000

SOCKET CARRIER SIP 20POS

Mill-Max Manufacturing Corp.

3,038
RFQ
714-93-120-41-001000

Datasheet

714 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-640-ZWGT-2

ICA-640-ZWGT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,654
RFQ
ICA-640-ZWGT-2

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
28-81000-610C

28-81000-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,155
RFQ
28-81000-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-81010-610C

28-81010-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,814
RFQ
28-81010-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-81250-610C

28-81250-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,606
RFQ
28-81250-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8240-610C

28-8240-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,587
RFQ
28-8240-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8250-610C

28-8250-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,118
RFQ
28-8250-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8300-610C

28-8300-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,828
RFQ
28-8300-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8370-610C

28-8370-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,788
RFQ
28-8370-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8375-610C

28-8375-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,455
RFQ
28-8375-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8400-610C

28-8400-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,913
RFQ
28-8400-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8459-610C

28-8459-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,199
RFQ
28-8459-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8472-610C

28-8472-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,256
RFQ
28-8472-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8495-610C

28-8495-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,685
RFQ
28-8495-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8500-610C

28-8500-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,657
RFQ
28-8500-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8600-610C

28-8600-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,230
RFQ
28-8600-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-8620-610C

28-8620-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,182
RFQ
28-8620-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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