IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-1718-T-T

APH-1718-T-T

APH-1718-T-T

Samtec Inc.

1,128
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0718-T-T

APH-0718-T-T

APH-0718-T-T

Samtec Inc.

2,183
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0318-T-T

APH-0318-T-T

APH-0318-T-T

Samtec Inc.

2,531
RFQ

-

* - Active - - - - - - - - - - - - - - -
116-41-308-41-006000

116-41-308-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,106
RFQ
116-41-308-41-006000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-308-41-006000

116-91-308-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,940
RFQ
116-91-308-41-006000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-41-103-41-005000

917-41-103-41-005000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.

4,382
RFQ
917-41-103-41-005000

Datasheet

917 Tube Active Transistor, TO-5 3 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-91-103-41-005000

917-91-103-41-005000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.

2,089
RFQ
917-91-103-41-005000

Datasheet

917 Tube Active Transistor, TO-5 3 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-83-642-41-013101

116-83-642-41-013101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

4,299
RFQ
116-83-642-41-013101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
30-9513-10H

30-9513-10H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,231
RFQ
30-9513-10H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-99-322-41-001000

110-99-322-41-001000

CONN IC DIP SOCKET 22POS TINLEAD

Mill-Max Manufacturing Corp.

1,258
RFQ
110-99-322-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-322-41-001000

110-44-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,596
RFQ
110-44-322-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-422-41-001000

110-44-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,208
RFQ
110-44-422-41-001000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-41-103-41-001000

917-41-103-41-001000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.

4,251
RFQ
917-41-103-41-001000

Datasheet

917 Tube Active Transistor, TO-5 3 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-11-308-41-001000

210-11-308-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,634
RFQ
210-11-308-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0313-T-10

HLS-0313-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,415
RFQ
HLS-0313-T-10

Datasheet

HLS Tube Active SIP 39 (3 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
20-3508-30

20-3508-30

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,176
RFQ
20-3508-30

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-8450-610C

16-8450-610C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,633
RFQ
16-8450-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-8500-610C

16-8500-610C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,638
RFQ
16-8500-610C

Datasheet

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0410-T-2

HLS-0410-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,293
RFQ
HLS-0410-T-2

Datasheet

HLS Bulk Active SIP 40 (4 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
210-99-324-41-001000

210-99-324-41-001000

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

4,549
RFQ
210-99-324-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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