IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
104-11-304-41-770000

104-11-304-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,953
RFQ
104-11-304-41-770000

Datasheet

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-93-126-41-013000

346-93-126-41-013000

CONN SOCKET SIP 26POS GOLD

Mill-Max Manufacturing Corp.

3,273
RFQ
346-93-126-41-013000

Datasheet

346 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-126-41-013000

346-43-126-41-013000

CONN SOCKET SIP 26POS GOLD

Mill-Max Manufacturing Corp.

1,505
RFQ
346-43-126-41-013000

Datasheet

346 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-83-121-13-001101

510-83-121-13-001101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

4,708
RFQ
510-83-121-13-001101

Datasheet

510 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-121-13-041101

510-83-121-13-041101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

2,023
RFQ
510-83-121-13-041101

Datasheet

510 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
48-6518-11

48-6518-11

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,994
RFQ
48-6518-11

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
16-6501-30

16-6501-30

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3,900
RFQ
16-6501-30

Datasheet

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
APA-624-T-M

APA-624-T-M

ADAPTER PLUG

Samtec Inc.

1,519
RFQ
APA-624-T-M

Datasheet

APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APA-422-T-M

APA-422-T-M

ADAPTER PLUG

Samtec Inc.

2,897
RFQ
APA-422-T-M

Datasheet

APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
08-2810-90

08-2810-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

4,928
RFQ
08-2810-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
24-516-10

24-516-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2,947
RFQ
24-516-10

Datasheet

516 Bulk Obsolete DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
ICO-316-AGT

ICO-316-AGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,954
RFQ
ICO-316-AGT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-648-ZSTT

ICA-648-ZSTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,928
RFQ
ICA-648-ZSTT

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
APA-632-T-A1

APA-632-T-A1

ADAPTER PLUG

Samtec Inc.

2,778
RFQ
APA-632-T-A1

Datasheet

APA Bulk Active - 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
PGA179H003B1-1836R

PGA179H003B1-1836R

PGA SOCKET 179 CTS

Amphenol ICC (FCI)

2,105
RFQ
PGA179H003B1-1836R

Datasheet

- - Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
ICO-320-MGG

ICO-320-MGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,195
RFQ
ICO-320-MGG

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-83-132-13-001101

510-83-132-13-001101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

2,658
RFQ
510-83-132-13-001101

Datasheet

510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-132-13-041101

510-83-132-13-041101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

4,708
RFQ
510-83-132-13-041101

Datasheet

510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-132-14-001101

510-83-132-14-001101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

2,565
RFQ
510-83-132-14-001101

Datasheet

510 Bulk Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-3511-11

18-3511-11

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

1,702
RFQ
18-3511-11

Datasheet

511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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