IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
10-8270-310C

10-8270-310C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

4,793
RFQ
10-8270-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-8375-310C

10-8375-310C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,175
RFQ
10-8375-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-8575-310C

10-8575-310C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,497
RFQ
10-8575-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-8620-310C

10-8620-310C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

1,961
RFQ
10-8620-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-8630-310C

10-8630-310C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,314
RFQ
10-8630-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APO-320-G-J

APO-320-G-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

4,687
RFQ
APO-320-G-J

Datasheet

APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
ICO-316-ZNGT

ICO-316-ZNGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,496
RFQ
ICO-316-ZNGT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-87-176-16-001101

510-87-176-16-001101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

2,416
RFQ
510-87-176-16-001101

Datasheet

510 Bulk Active PGA 176 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-176-16-071101

510-87-176-16-071101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

4,594
RFQ
510-87-176-16-071101

Datasheet

510 Bulk Active PGA 176 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-181-14-031101

510-87-181-14-031101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

2,722
RFQ
510-87-181-14-031101

Datasheet

510 Bulk Active PGA 181 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
714-43-118-31-018000

714-43-118-31-018000

CONN SOCKET SIP 18POS GOLD

Mill-Max Manufacturing Corp.

2,828
RFQ
714-43-118-31-018000

Datasheet

714 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-87-648-41-011101

116-87-648-41-011101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

4,975
RFQ
116-87-648-41-011101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-180-15-002101

510-87-180-15-002101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

3,392
RFQ
510-87-180-15-002101

Datasheet

510 Bulk Active PGA 180 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-180-15-041101

510-87-180-15-041101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

1,033
RFQ
510-87-180-15-041101

Datasheet

510 Bulk Active PGA 180 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-632-SST

ICO-632-SST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,993
RFQ
ICO-632-SST

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0210-T-11

HLS-0210-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,864
RFQ
HLS-0210-T-11

Datasheet

HLS Tube Active SIP 20 (2 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
PGA175H009B5-1620R

PGA175H009B5-1620R

PGA SOCKET 175 CTS

Amphenol ICC (FCI)

2,343
RFQ
PGA175H009B5-1620R

Datasheet

- - Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
299-43-316-10-001000

299-43-316-10-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

1,121
RFQ
299-43-316-10-001000

Datasheet

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-322-ZMGT

ICO-322-ZMGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,578
RFQ
ICO-322-ZMGT

Datasheet

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-422-ZMGT

ICO-422-ZMGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,529
RFQ
ICO-422-ZMGT

Datasheet

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 335336337338339340341342...955Next»
Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER