IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
32-C212-10

32-C212-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,152
RFQ
32-C212-10

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-C300-10

32-C300-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

4,852
RFQ
32-C300-10

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
2-1571550-9

2-1571550-9

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

3,804
RFQ
2-1571550-9

Datasheet

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-83-964-41-001101

614-83-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

3,464
RFQ
614-83-964-41-001101

Datasheet

614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
48-6511-10

48-6511-10

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

4,909
RFQ
48-6511-10

Datasheet

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
36-3513-10T

36-3513-10T

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

1,152
RFQ
36-3513-10T

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-83-100-11-001101

510-83-100-11-001101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

2,035
RFQ
510-83-100-11-001101

Datasheet

510 Bulk Active PGA 100 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-179-18-001101

510-87-179-18-001101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

1,719
RFQ
510-87-179-18-001101

Datasheet

510 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-0501-20

06-0501-20

CONN SOCKET SIP 6POS TIN

Aries Electronics

1,490
RFQ
06-0501-20

Datasheet

501 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
06-0501-30

06-0501-30

CONN SOCKET SIP 6POS TIN

Aries Electronics

1,296
RFQ
06-0501-30

Datasheet

501 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICF-320-S-I

ICF-320-S-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

1,009
RFQ
ICF-320-S-I

Datasheet

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
APA-318-T-A

APA-318-T-A

ADAPTER PLUG

Samtec Inc.

4,157
RFQ
APA-318-T-A

Datasheet

APA Bulk Active - 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
ICF-324-TM-O-TR

ICF-324-TM-O-TR

.100" SMT SCREW MACHINE DIP SOCK

Samtec Inc.

4,760
RFQ
ICF-324-TM-O-TR

Datasheet

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
HLS-0206-G-10

HLS-0206-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,329
RFQ
HLS-0206-G-10

Datasheet

HLS Tube Active SIP 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
510-87-181-17-001101

510-87-181-17-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

4,364
RFQ
510-87-181-17-001101

Datasheet

510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
XR2A-3221-N

XR2A-3221-N

CONN IC DIP SOCKET 32POS GOLD

Omron Electronics Inc-EMC Div

1,836
RFQ
XR2A-3221-N

Datasheet

XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
06-6822-90C

06-6822-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,086
RFQ
06-6822-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
06-6823-90C

06-6823-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

4,923
RFQ
06-6823-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
124-83-636-41-002101

124-83-636-41-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2,359
RFQ

-

124 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-432-41-004101

116-83-432-41-004101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

4,025
RFQ
116-83-432-41-004101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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