IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
346-93-130-41-013000

346-93-130-41-013000

CONN SOCKET SIP 30POS GOLD

Mill-Max Manufacturing Corp.

3,756
RFQ
346-93-130-41-013000

Datasheet

346 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-130-41-013000

346-43-130-41-013000

CONN SOCKET SIP 30POS GOLD

Mill-Max Manufacturing Corp.

1,397
RFQ
346-43-130-41-013000

Datasheet

346 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-13-304-41-001000

612-13-304-41-001000

SOCKET CARRIER SLDRTL .300 4POS

Mill-Max Manufacturing Corp.

3,402
RFQ
612-13-304-41-001000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-210-31-018000

714-43-210-31-018000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

4,889
RFQ
714-43-210-31-018000

Datasheet

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-43-656-41-005000

117-43-656-41-005000

CONN IC DIP SOCKET 56POS GOLD

Mill-Max Manufacturing Corp.

3,414
RFQ
117-43-656-41-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
540-44-084-17-400004

540-44-084-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

1,473
RFQ
540-44-084-17-400004

Datasheet

540 Tape & Reel (TR) Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
116-47-304-41-001000

116-47-304-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,460
RFQ
116-47-304-41-001000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-13-304-41-001000

122-13-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

4,536
RFQ
122-13-304-41-001000

Datasheet

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-124-31-018000

714-43-124-31-018000

CONN SOCKET SIP 24POS GOLD

Mill-Max Manufacturing Corp.

4,477
RFQ
714-43-124-31-018000

Datasheet

714 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-304-41-001000

116-41-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,945
RFQ
116-41-304-41-001000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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