| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-88-316-41-530000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,524 |
|
Datasheet |
110 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
210-88-306-41-001000STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp. |
1,439 |
|
- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
110-88-314-41-001000STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp. |
2,960 |
|
- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
|
110-83-314-41-530000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
4,769 |
|
- |
110 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-88-316-41-001000STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp. |
1,965 |
|
- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
210-83-306-41-001000STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp. |
3,961 |
|
- |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Beryllium Copper | Thermoplastic | -55°C ~ 125°C |
|
110-83-308-41-001000STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp. |
3,886 |
|
- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
210-83-308-41-001000STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp. |
3,648 |
|
Datasheet |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
510-13-209-17-081002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
1,581 |
|
Datasheet |
510 | Bulk | Active | PGA | 209 (17 x 17) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-88-318-41-001000STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp. |
3,960 |
|
- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic | -55°C ~ 125°C |