IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
614-91-950-31-002000

614-91-950-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,366
RFQ
614-91-950-31-002000

Datasheet

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-324-61-001000

110-91-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,447
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-424-61-001000

110-91-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,139
RFQ

-

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-624-61-001000

110-91-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,354
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-950-31-007000

614-41-950-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,352
RFQ
614-41-950-31-007000

Datasheet

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-950-31-007000

614-91-950-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,698
RFQ
614-91-950-31-007000

Datasheet

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-640-41-780000

104-13-640-41-780000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

1,247
RFQ
104-13-640-41-780000

Datasheet

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
116-41-950-41-007000

116-41-950-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,944
RFQ
116-41-950-41-007000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-950-41-007000

116-91-950-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,977
RFQ
116-91-950-41-007000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-064-01-505000

110-93-064-01-505000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,348
RFQ
110-93-064-01-505000

Datasheet

110 Tube Active - 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - - -
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