IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-43-640-41-801000

110-43-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

4,980
RFQ
110-43-640-41-801000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-41-801000

110-93-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2,527
RFQ
110-93-640-41-801000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-314-41-001000

123-43-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

1,709
RFQ
123-43-314-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-424-41-001000

110-99-424-41-001000

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

4,535
RFQ
110-99-424-41-001000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-324-41-001000

110-47-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,209
RFQ
110-47-324-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-210-10-001000

110-43-210-10-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

1,777
RFQ
110-43-210-10-001000

Datasheet

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5), 6 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-93-324-41-001000

210-93-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,636
RFQ
210-93-324-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
214-99-628-01-670800

214-99-628-01-670800

CONN IC DIP SOCKET 28POS TINLEAD

Mill-Max Manufacturing Corp.

1,404
RFQ
214-99-628-01-670800

Datasheet

214 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-648-41-001000

110-47-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

3,457
RFQ
110-47-648-41-001000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (1 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-624-41-001000

115-43-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

1,517
RFQ
115-43-624-41-001000

Datasheet

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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