IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
299-93-622-10-002000

299-93-622-10-002000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

195
RFQ
299-93-622-10-002000

Datasheet

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-950-41-001000

123-43-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

179
RFQ
123-43-950-41-001000

Datasheet

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-640-41-801000

123-43-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

145
RFQ
123-43-640-41-801000

Datasheet

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-636-10-002000

299-93-636-10-002000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

183
RFQ
299-93-636-10-002000

Datasheet

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
523-93-121-13-061001

523-93-121-13-061001

PGA SOCK 121PIN 13X13 WIRE WRAP

Mill-Max Manufacturing Corp.

295
RFQ
523-93-121-13-061001

Datasheet

523 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole - Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -
917-47-108-41-005000

917-47-108-41-005000

CONN SOCKET TRANSIST TO-5 8POS

Mill-Max Manufacturing Corp.

3,175
RFQ
917-47-108-41-005000

Datasheet

917 Tube Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-47-210-41-005000

917-47-210-41-005000

CONN SOCKET TRANSIST TO-5 10POS

Mill-Max Manufacturing Corp.

1,754
RFQ
917-47-210-41-005000

Datasheet

917 Tube Active Transistor, TO-100 10 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-308-10-001000

110-43-308-10-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

2,982
RFQ
110-43-308-10-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4), 4 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-318-41-001000

110-13-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3,169
RFQ
110-13-318-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-13-308-41-001000

123-13-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

4,029
RFQ
123-13-308-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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