IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
115-43-328-41-003000

115-43-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

181
RFQ
115-43-328-41-003000

Datasheet

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-628-41-003000

115-43-628-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

168
RFQ
115-43-628-41-003000

Datasheet

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-328-41-003000

115-93-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

138
RFQ
115-93-328-41-003000

Datasheet

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-314-31-012000

614-43-314-31-012000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

152
RFQ
614-43-314-31-012000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
540-44-020-17-400000

540-44-020-17-400000

CONN SOCKET PLCC 20POS TIN

Mill-Max Manufacturing Corp.

359
RFQ
540-44-020-17-400000

Datasheet

540 Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
614-43-316-31-012000

614-43-316-31-012000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

315
RFQ
614-43-316-31-012000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-47-642-41-005000

117-47-642-41-005000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

133
RFQ
117-47-642-41-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-318-31-012000

614-93-318-31-012000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

121
RFQ
614-93-318-31-012000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-310-10-001000

299-43-310-10-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

126
RFQ
299-43-310-10-001000

Datasheet

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-93-318-41-001000

123-93-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

113
RFQ
123-93-318-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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